Wafer-scale surface activated bonding of silicon, silicon oxide and copper at low temperature

収録刊行物

• 7th Int. Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications, Paris, France, April/May 2003

  7th Int. Symposium on Semiconductor Wafer Bonding Science, Technology, and Applications, Paris, France, April/May 2003 1040 2003