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New Three-Dimensional Integration Technology Using Chip-to-Wafer Bonding to Achieve Ultimate Super Chip Integration
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- FUKUSHIMA Takafumi
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
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- YAMADA Yusuke
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
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- KIKUCHI Hirokazu
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
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- KOYANAGI Mitsumasa
- Department of Bioengineering and Robotics, Graduate School of Engineering, Tohoku University
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Journal
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- Extended abstracts of the ... Conference on Solid State Devices and Materials
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Extended abstracts of the ... Conference on Solid State Devices and Materials 2005 64-65, 2005-09-13
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Details 詳細情報について
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- CRID
- 1570572700671647872
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- NII Article ID
- 10022540983
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- NII Book ID
- AA10777858
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- Text Lang
- en
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- Data Source
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- CiNii Articles