Comparison of Degradation of Solder Joints between Thermal Shock Test and Sloped Thermal Cycling Test

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Bibliographic Information

Other Title
  • 温度サイクル試験と熱衝撃試験におけるはんだ接合部の劣化についての比較評価

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Description

In space, high reliability solder joints are required in thermal cycling environment due to sunshine and shade. We NASDA are studing the plan of 'surface mount soldering Process standard' for high density mounting on space components. In this plan, 'thermal shock test' is required in place of 'sloped thermal cycling test'. In this report, we evaluated the cracks in solder Joints and the solder crystallizations, and studied effective test methods, by comparing between 'thermal shock test' and 'sloped thermal cycling test'.

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Details 詳細情報について

  • CRID
    1570854177466158208
  • NII Article ID
    110003301779
  • NII Book ID
    AN10013243
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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