Effect of Cl2 Addition to O2 Plasma on RuO2 Etching : Quarter micron size dry etching of RuO2 thin films for Gb DRAMs
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- TOKASHIKI Ken
- ULSI Device Development Laboratories, NEC Corporation
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- SATO Kiyoyuki
- ULSI Device Development Laboratories, NEC Corporation
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- MIYAMOTO Hidenobu
- ULSI Device Development Laboratories, NEC Corporation
Bibliographic Information
- Other Title
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- RuO2ドライエッチングにおける塩素添加効果 : 導電性酸化膜から成るGbクラスDRAM容量電極の微細加工方法
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Description
We investigated the dry etching characteristics of RuO2 films. It is found that a small addition of chlorine to an oxygen plasma causes an marked enhancement of the RuO2 etching rate. In this sutdy, the phenomena as mentioned above will be described and discussed in detail. Futhermore, we show the fabrication of RuO2 electrodes for high dielectric constant thin film capacitors for 1Gb DRAM.
Journal
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- Technical report of IEICE. SDM
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Technical report of IEICE. SDM 95 (206), 43-50, 1995-08-17
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1571417127419442816
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- NII Article ID
- 110003309795
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- NII Book ID
- AN10013254
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- Text Lang
- ja
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- Data Source
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- CiNii Articles