Optical module with MU connector interface using self-alignment technique by solder-bump chip bonding

HAYASHI Tsuyoshi, TSUNETSUGU Hideki

Bibliographic Information

Other Title

はんだバンプによるセルフアライメントを用いたMUレセプタクル形受光モジュール

Description

We applied a self-alignment technique that uses solder-bump chip bonding to alignment between photonic devices and optical fibers in optical modules. To achieve this, a chip-carrier with a ferrule which had a single-mode fiber inside it was developed. By solder bump bonding a photodiode onto the chip-carrier, we achieved a compact and simple MU receptacle-type receiver module that requires no optical-axis adjustment. Coupling evaluation by ray tracing method implied that our new receptacle module structure would also be applicable to LED-or VCSEL-to-fiber coupling in transmitter modules.

Journal

IEICE technical report. Component parts and materials

IEICE technical report. Component parts and materials 96 (218), 49-54, 1996-08-20

The Institute of Electronics, Information and Communication Engineers

Keywords

Details 詳細情報について

CRID: 1573105977189841792

NII Article ID: 110003199078

NII Book ID: AN10012932

Text Lang: ja

Data Source

CiNii Articles

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